Merge tag 'thermal-7.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
 "These are mostly updates of thermal drivers including a new Exynos
  ACPM thermal driver for Google GS101, new Renesas RZ/G3L thermal
  sensor support, new Qualcomm MSM8952 TSENS support, new Qualcomm
  PMAU0102 Master BandGap temperature monitor support in DT bindings,
  and new rugged Panther Lake support in intel_tcc_cooling. Moreover,
  the AN7583 driver is extended to register separate thermal zones for
  bandgap, GbE and CPU (its DT bindings are updated accordingly).

  There are also multiple fixes and assorted cleanups, as usual.

  Specifics:

   - Make the Intel powerclamp thermal driver reject invalid window_size
     values, drop redundant clamp() from duration_set() in it, and
     simplify 4 functions in it (Thorsten Blum)

   - Add rugged Panther Lake support to the intel_tcc_cooling thermal
     driver (Srinivas Pandruvada)

   - Fix temperature selection around 0 C in the int340x thermal driver,
     drop redundant else from proc_thermal_add() in it, and simplify
     slider_def_*_set() in it (Thorsten Blum)

   - Drop unbalanced paren from cpu-idle-cooling.rst (Manuel Ebner)

   - Use %pe to print error pointers symbolically in the thermal control
     code and fix assorted typos in comments in it (Sumeet Pawnikar and
     Hemanth Selam)

   - Add the Exynos ACPM thermal driver for Google GS101, along with DT
     bindings and a MAINTAINERS entry (Tudor Ambarus)

   - Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
     default calibration values to per-SoC match data (Biju Das)

   - Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
     compatible (Muzaffer Kadir)

   - Document the Qualcomm PMAU0102 Master BandGap temperature monitor
     compatible in the DT bindings (Dhruvin Rajpura)

   - Extend the QCom TSENS v2 trip temperature limits to the hardware
     range of -204°C to +204°C to prevent interrupt storms when
     operating beyond the previous software limits (Priyansh Jain)

   - Fix temperature threshold map indexing in the QCom SPMI temperature
     alarm driver to prevent out-of-bounds reads (Georgi Djakov)

   - Describe the additional bus clock required by the Amlogic T7
     thermal sensor and switch the driver to the clk_bulk API to manage
     multiple clocks (Ronald Claveau)

   - Request the Airoha EN7581 IRQ after thermal zone registration to
     prevent the interrupt handler from accessing an unregistered or
     already freed thermal zone (Vitaliy Sochnev)

   - Fix the Airoha AN7583 ADC mux field mapping, serialize access to
     the shared ADC, and verify mux selection to avoid invalid
     temperature readings and spurious critical shutdowns (Vitaliy
     Sochnev)

   - Register separate thermal zones for the AN7583 bandgap, GbE and CPU
     sensors, and update the DT bindings to use one thermal sensor cell
     to select the sensor (Vitaliy Sochnev)

   - Fix signed integer overflow in the Renesas RZ/G3E
     temperature-to-code conversion, preserve compare interrupt state
     across runtime PM, and prevent overlapping temperature conversions
     (Ovidiu Panait)

   - Remove redundant trip window validation and runtime PM
     pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
     (Ovidiu Panait)

   - Propagate reset assertion failures from Renesas RZ/G3E suspend and
     attempt to restore power if the sensor was active (Pengpeng Hou)

   - Stop the TI bandgap alert IRQ before removing sensor interfaces and
     cancel pending alert work to prevent use-after-free on driver
     removal (Weigang He)

   - Validate Spreadtrum sensor IDs read from the device tree before
     using them for register offsets and array indexing (Weigang He)

   - Convert the TI OMAP bandgap DT bindings to schema and document the
     DRA752 compatible and thermal sensor cells (Bhargav Joshi)

   - Use DT property helpers matching the signed temperature and
     unsigned hysteresis types defined by the thermal zone bindings (Rob
     Herring)

   - Reuse common error handling code in the power allocator governor
     bind callback (Markus Elfring)

   - Constify the thermal zone device operations in the i.MX9 driver
     (Christophe JAILLET)

   - Fix kernel-doc parameter names and firmware node references in the
     cooling device registration helpers (Aryan Sinha)

   - Correct the documented return value of ti_bandgap_get_sensor_data()
     to describe validation errors and potentially NULL stored data
     (Karl Mehltretter)

   - Ensure NUL-termination when copying the cooling device command-line
     argument in tmon and fix the associated string truncation warning
     (Florian Fainelli)

   - Fix undefined behavior caused by a signed shift in the tmon thermal
     zone binding display (Liu Jing)

   - Fix wording in tmon comments (Hemanth Selam)

   - Simplify cpufreq_set_cur_state() in the cpufreq_cooling thermal
     control driver (Thorsten Blum)"

* tag 'thermal-7.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (51 commits)
  thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
  thermal: ti-soc-thermal: Fix the return value in ti_bandgap_get_sensor_data() kernel-doc
  thermal/fw: Fix kernel-doc parameter names
  thermal/qcom/tsens: Add support for MSM8952 tsens
  dt-bindings: thermal: tsens: Add MSM8952
  thermal/drivers/amlogic: Switch to clk_bulk API to support multiple clocks
  dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
  tools/thermal/tmon: Fix string truncation warning in optarg copy
  thermal/drivers/airoha: Register a thermal zone per AN7583 sensor
  dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
  thermal/drivers/airoha: Serialise access to the shared ADC
  thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
  thermal/drivers/sprd: validate the sensor id from the device tree
  thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
  thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing
  thermal: gov_power_allocator: Use common error handling code in power_allocator_bind()
  tools/thermal/tmon: Fix signed shift UB in binding display
  MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
  thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
  dt-bindings: thermal: Add Google GS101 TMU
  ...